| Parameter | Technical Data | Remarks |
|---|---|---|
| Thickness of Single Layer | 15/30/50 μm | Adjustable |
| Thickness of Multilayer | 3 mm | Total Thickness |
| Fastest Speed for Single Layer Packaging | 15 s | 320*400 mm |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Number of Axes | 3 | |
| Movement Speed (XY) | 200 or 300 or 400 mm/s | Low/Medium/High |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Packaging Accuracy | ±0.1 mm | |
| Repeat Accuracy | ±0.02 mm |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Max. panel size X- and Y-direction | 400*320 mm | |
| Max Working Load | 3 kg |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Max. Size | 400*320 mm | |
| Max. Component Height | ≤10 mm (recommend) |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Software System | KP400 Smart Software | Own IPR |
| Windows Operating System | Win10 |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Voltage | 220V/ 50Hz/ 3kW | |
| Compressed Air | >0.5Mpa | |
| Ambient Temperature | 17-28°C | |
| Relative Air Humidity | 30-70%RH |
| Parameter | Technical Data | Remarks |
|---|---|---|
| Size (LWH) | 1500*1370*1570 mm | |
| Weight | 1250 kg |
| Component | Technical Data / Specification |
|---|---|
| Nozzle | Piezo printing nozzle |
| Drive Motor (XY/ZR) | XY linear motor/ZR stepper motor |
| Curing System | Dual head UV-LED(water cooled) |
| Visual Positioning System | 500W Industrial camera with high precision telecentric lens. |
| UV Ink System | Independent dual loop |
| Motion Guide Rail | Precision linear guide rail |
| Parameter | Technical Data / Specification |
|---|---|
| Max. height of conveying surface | 25 mm above and 80 mm below |
| Opening & Closing Speed | 30 mm/s |
| Conveying Heigh | 900±20 mm or 1000±20 mm |
| Conveying Speed | 5-10 m/min |
| Conveyor Type: | High temperature and anti-static belt |
| Transfer Direction | L→R (R→L optional) |
| PCB Edge Space | ≥5 mm |
| Property | Technical Specification |
|---|---|
| Viscosity | 10-15cps (Operation temperature 30°C~55°C) |
| Surface Tension | 25-35dyn/cm |
| PH Value | 6-8 |
| Particle Size | D90≤200 nm |
| Curing Method | UV curing |
| Property | Technical Specification |
|---|---|
| Viscosity | 10-15cps (Operation temperature 30°C~55°C) |
| Surface Tension | 25-35dyn/cm |
| PH Value | 6-8 |
| Particle Size | D90≤200 nm |
| Curing Method | UV curing |
KP400 applies 3D printing technology to electronic packaging protection, is a new concept of product packaging protection equipment. Accurately spray UV glue onto the areas that require protection, and form various 3D shapes through multi-layer stacking, providing high-strength protection for electronic components such as PCBA and FPC.
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